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Intel® Pentium® III XeonProcessor

The Intel® Pentium® III Xeonprocessor is specifically

designed to meet the demands of front-end, mid-range

and higher servers. The Pentium III Xeon processor

combines features such as Streaming SIMD Extensions

and faster operating frequency, with proven Intel

characteristics such as architectural compatibility with

past microprocessors and Dynamic Execution and

Dual Independent Bus architecture of the P6 microarchitecture.

The Pentium III Xeon processor brand

name represents the superior performance, availability

and flexible scalability required by front-end, mid-range

and higher server customers at breakthrough

price/performance.

The Pentium III Xeon processor at 1 GHz (256 KB),

validated in 2-way configurations, delivers leading

price/performance for value entry server platforms.

The Pentium III Xeon processor at 700 and 900 MHz

(1 MB– 2 MB), validated in 4-way, 8-way and greater

configurations, delivers enterprise-class performance

for high-end platforms. Streaming SIMD Extensions

in server applications provide network performance

headroom via benefits to TCP/IP Internet applications

as well as performance improvements to memory or

cache-intensive applications. Servers based on the

Pentium III Xeon processor will continue to provide

enterprise-class performance for high-end platforms

and leading value and performance.

Product Description

Intel Pentium III Xeon processors are available at

speeds up to 900 MHz for multiprocessor servers

and 1 GHz for dual processor servers to provide the

best Intel performance available for applications running

on advanced operating systems such as Windows*

2000 Datacenter, NetWare,* Linux* and UNIX.* Intel

Pentium III Xeon processors are available in 2-, 4-,

8-way and beyond platform solutions, providing

scalability to meet most platform computing needs.

Chipset Support

The Pentium III Xeon processor is supported by the

Profusion® chipset and other third party chipsets.

Performance Enhancing Features

Incorporates an L2 cache of 256 KB (1 GHz) for dual

processor systems and 1 MB or 2 MB (700 MHz and

900 MHz) for 4-way, 8-way and greater configurations.

Level 2 caches provide a performance boost to server

applications and other applications that work on large

data sets.

Uses Streaming SIMD Extensions — concurrent

SIMD-FP and memory streaming architecture,

and 70 new media instructions that provide a performance

boost to TCP/IP Internet applications, 3D

graphics, memory and cache-intensive applications.

The L2 cache bus operates at the same frequency

as the processor cores.

Shares data with the rest of the system via the high

capacity 100 MHz (700 MHz and 900 MHz) or 133 MHz

(1 GHz) multi-transactional, another breakthrough technology

extending the potential of superior processing

speeds to the rest of the system.

Addresses for caching up to 64 GB of memory for

increased performance and throughput on the most

sophisticated applications.

 

the performance of streaming

media applications and memoryintensive

applications

Available in unified, non-blocking

Level 2 (L2) cache 256 KB (1 GHz),

1 MB (700 MHz) and 2 MB (700

and 900 MHz)

32 KB (16 KB data /16 KB instruction)

non-blocking, Level 1 cache provides

fast access to heavily used data

Full speed cache allows fast

access to Level 2 memory

Dual Independent Bus (DIB)

architecture increases performance

and provides more data to the

processor core

Multiprocessor (4-way and above)

systems use 100 MHz bus for data

transfers between processors and

system; dual processor systems

transfer data between the processors

and system at 133 MHz

Cacheable address space up to 64 GB

The Intel® Pentium® III Xeonprocessor

offers support for glueless 2-way and

4-way SMP operation and can effectively

scale beyond 8-way with specialized

chipset and clustering technologies

Intel® Extended Server Memory

Architecture – expanded 36-bit

memory support allowing operating

systems and applications to use

memory greater than 4 GB

Single Edge Contact Cartridge

(SECC) packaging technology delivers

state-of-the-art processing and bus

technology to front-end, mid-range

and higher servers

Drop-in compatible with motherboards

using SC330 (330 pin slot

connector) packaging

Advanced Manageability Features

Thermal sensor allowing system to

actively manage thermal conditions

Error Correction Code (ECC)

to maintain the integrity of

mission-critical data

Functional Redundancy Checking

(FRC) to confirm processing integrity

System Management Bus (SMBus) for

efficient communications between the

processor thermal sensor, processor

specific P.I. ROM, OEM-writeable

EEPROM and the rest of the system

Product

Brief

 

INTEL XEON

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Last modified: July 07, 2011